Terminal manufacturers constantly develop and research new technologies in order to increase their core competitiveness and adapt to the application needs of the market. In the face of fierce competition in the terminal market, continuous improvement can be recognized by customers.

At present, the functions of electronic products are becoming more and more powerful and comprehensive, which puts forward higher and more diversified requirements for connectors. For example, the transmission rate of electronic equipment is getting higher and higher. In order to meet the transmission and exchange of large flow data, the requirements for high-speed transmission and digital transmission are put forward for connectors. However, in order to save equipment space and reduce equipment volume, more and more signals, such as microwave signals, optical signals, high-voltage signals, power signals, etc., need to be integrated into the same connector, and all signals are required to be transmitted independently without interference, which determines that the development trend of connector signal transmission integration will become more and more obvious.

The demand of the market for the centralized and miniaturized trend of connectors promotes the technical innovation of terminal blocks. Semiconductor chip technology is becoming the technical driving force for connector development in interconnects at all levels. For example, with the rapid development of 0.5mm spacing chip packaging to 0.25mm spacing, the number of device pins for Level I interconnects (inside IC devices) and Level II interconnects (interconnects between devices and boards) has increased from hundreds to thousands. The press fit contact technology is widely used in cylindrical slotted socket, elastic stranded wire pin and hyperboloid wire spring socket connector, which greatly improves the reliability of the connector and ensures the high fidelity of signal transmission.

The terminal block technology makes the connector form a new connector product, namely push on connector, which is mainly used for system level interconnection. Its greatest advantage is that it does not need cables, is simple to install and disassemble, is convenient for on-site replacement, and has fast insertion and closing speed, smooth and stable separation, and can obtain good high-frequency characteristics, which is suitable for spaceships. Connector assembly technology is developing from plug-in installation technology to surface mount technology, and the future trend is to develop to micro assembly technology. The use of MEMS will be the driving force to improve connector technology and cost performance.